• <dd id="mnluo"></dd><progress id="mnluo"></progress>
    <dd id="mnluo"></dd>

  • Skip navigation Accessibility information

    Custom-made Ceramic
    and Glass Components

    High Thermal Conductivity Silicon Nitride

    Goodfellow can now offer high thermal conductivity Silicon Nitride. This material is ideal for specialist applications, and offers several benefits.

    • High thermal conductivity of 100W/mK. Which is 4X higher than standard Silicon Nitride. 
    • High fracture toughness. 
    • Can be polished to a surface roughness of Ra = 0.02um.  
    • Excellent mechanical properties.

    Typical Properties of this material

    Properties

    Units

    High Thermal Conductivity Silicon Nitride

    Density

    g/cm3

    3.3

    Flexural Strength

    (25°C) (MPa)

    700

    Linear Expansion Coefficient

    (25-800°C) (1/K)

    3x10-6

    Thermal Conductivity

    W/mK

    100

    Youngs Modulus

    GPa

    312

    Poissons Ratio

     

    0.29

    Volume Resistivity

     

    >1013

    Typical Applications

    • Power module substrates
    • Various types of heat sinks
    • LED mounting substrates
    • High frequency circuit substrates

    Shapes and sizes available

    The standard substrate size is 100mm x 100mm with a 0.32mm thickness. Different sizes and thicknesses are available upon request.

     

    • New Products

      New Product Announcements from Goodfellow
      :: Read more ::

    • Exhibitions

      View the Latest Research and Industrial Product Exhibitions
      :: Read more ::

    • Newsletters

      Corporate Newsletters from Goodfellow providing professional information and announcements
      :: Read more ::

    • Press Releases

      Official Press Releases from Goodfellow covering a range of technical areas and products
      :: Read more ::

    XXXXX中国少妇